Dedicated to advances, research, development and applications in the area of wafer manufacturing, circuit design, assembling and system engineering, the overall content of the SCD 2008 is as follows:
-> Circuit and system design
-> Design flow
-> Simulation and modeling
-> Measurement equipment
and testing
-> System packaging |
-> Wafer fabrication,
automation and reliability
-> Semiconductor materials
-> Wafer level packaging
-> Clean room equipment
and services
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Workshop presentations and short courses
Scientific paper publications
Table top exhibition and trade shows
Networking with leading experts from industry and universities
Social events |
Corresponding applications are in the area of automotive electronic, mobile communications, high speed interconnects, navigation, devices for measurements and testing, wireless networks, RFID, optical communication, memory modules, sensor networks, remote keyless entry, multi-core microprocessors, etc.
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