Program SCD 2009
Attention: program modification!
The lecture C1-1 (V. Mühlhaus/Sonnet EM Analysis for RFIC/MMIC) takes place on
Wednesday at 3.00 pm - 4.30 pm
| Wednesday, April 29, 2009 | ||||
| C. Zimmer-Konrad, H. Eul, G. Fettweis / Overall Chair, F. Ellinger / Technical Chair: Get Together and Welcome |
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| Block A1 Session Chair M. Schroeter |
Radio Frequency Technologies and Communication Systems |
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| R. Kraemer/IHP GmbH | A1-1 | Challenges for Wireless 100 Gb/s Transmission from System down to IC Level (INVITED) | 9.30 am - 10.00 am | |
| M. Schlechtweg, A.Tessmann, I. Kallfass, A. Leuther, R. Weber, S. Chartier, R. Driad, R. E. Makon, V. Hurm, H. Massler, M. Kuri, F. Benkhelifa, R. Lösch, J. Rosenzweig, and O. Ambacher/ Fraunhofer Institute for Applied Solid State Physics (IAF) |
A1-2 | High-Performance MMICs and High-Speed Mixed-Signal ICs Based on III/V HEMT and HBT Technology for Sensors and Communication (INVITED) | 10.00 am - 10.30 am | |
| R. Lachner/ Infineon Technologies |
A1-3 | SiGe Technology Paves the Way for Radar Based Vehicle Safety Affordable for Everyone (INVITED) | 10.30 am - 11.00 am | |
| Block A2 Session Chair M. Claus |
Hetero Bipolar Transistor Technology | |||
| C. R. Bolognesi/ETH Zürich | A2-1 | High-Speed High-Power mm-Wave Devices (INVITED) | 1.00 pm - 1.30 pm | |
| M. Schroeter/TU Dresden/ UC San Diego, USA |
A2-2 | Future Opportunities for Bipolar Transistor Technology (INVITED) | 1.30 pm - 2.00 pm | |
| M. Al-Sa’di, C. Maneux, T. Zimmer/Université de Bordeaux, S. Fregonese/CNRS, Talence Cedex, France |
A2-3 | Investigation of Electrical BJT Performance Improvement through Extrinsic Stress Layer Using TCAD Modeling | 2.00 pm - 2.20 pm | |
| Block A3 Session Chair M. Schroeter |
Device and Technology Modeling | |||
| D. Schreurs/Katholieke Universiteit Leuven, Belgien | A3-1 | Microwave Modelling of Emerging Device Technologies (INVITED) | 2.40 pm - 3.10 pm | |
| K. E. Moebus, Y. Zimmermann, M. Schroeter, Dresden University of Technology/ UC San Diego, USA |
A3-2 | Schwarz-Christoffel Mapping for LDMOS and Bipolar Transistor Modeling | 3.10 pm - 3.30 pm | |
| M. Claus, S. Mothes, M. Schroeter/Dresden University of Technology |
A3-3 | A Numerical Device Simulator for Nanoscale Carbon Nanotube Transistors | 3.30 pm - 3.50 pm | |
| Y. Zimmermann, K. E. Moebus, H. Wittkopf, M. Schroeter/ Dresden University of Technology/ UC San Diego, USA |
A3-4 | TRADICA – An Integrated Modeling Tool Linking Process and Circuit Design | 3.50 pm - 4.10 pm | |
| B. Curran, I. Ndip, S. Guttovski/Fraunhofer Institute for Reliability and Microintegration, Berlin, H. Reichl/TU Berlin |
A3-5 | Modeling and Categorization of the Resistivity of Silicon Wafers for the Design of Silicon Based System Modules | 4.10 pm - 4.30 pm | |
| Block B1 Session Chair G. Fettweis |
Digital Embedded Systems | |||
| H. Meyr/RWTH Aachen | B1-1 | Next Generation Mobile Devices: A System Design Challenge (INVITED) |
9.30 am - 10.00 am | |
| M. Porrmann/ Universität Paderborn |
B1-2 | Rapid Prototyping of Next-Generation Multiprocessor SoCs (INVITED) | 10.00 am - 10.30 am | |
| S.-B. Kim, R. Wunderlich, S. Heinen/RWTH Aachen / IC design and Microelectronics Center, State Academy of Sciences, Pyongyang, DPR Korea |
B1-3 | A Consideration on Design Methods for Continuous-Time Quadrature Bandpass Sigma-Delta Modulators | 10.30 am - 10.50 am | |
| Block B2 Session Chair R. Eickhoff |
Low Power Digital Design | |||
| U. Rückert/ Universität Paderborn |
B2-1 | Potential of Subthreshold Logic for Ultra Low-Power Digital Systems (INVITED) | 11.10 am - 11.40 am | |
| T. Noll/RWTH Aachen | B2-2 | Energy Efficiency vs. Reliability in the Last Quarter of Moore’s Law (INVITED) | 11.40 am - 12.10 pm | |
| D. Brenk, J. Essel, J. Heidrich, F. Cilek, R. Weigel/ Friedrich Alexander University Erlangen-Nuremberg |
B2-3 | An Ultra Low Power ADC for Sensor Applications in Passive UHF RFIDs | 12.10 pm - 12.30 pm | |
| Block B3 Session Chair N. Thyssen |
Mixed Signal Circuit Testing Communication Systems | |||
| U. Sobe, K.-H. Rooch, D. Mörtl, A. Graupner/ ZMD AG, A. Lerch/X-FAB Semiconductor Foundries AG, Erfurt, M. Pronath/MunEDA GmbH, München |
B3-1 | Verification Method for Analog and Mixed Circuits Considering Performance Parameters and Safe Operating Area (SOA) Constraints |
1.30 pm - 1.50 pm | |
| I.Gryl, V. Schulze/IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gGmbH, Ilmenau | B3-2 | Application of a Modular Test System for Mixed Signal Tests | 1.50 pm - 2.10 pm | |
| A. Rolapp, R. Paris/ IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gGmbH, Ilmenau |
B3-3 | Parametric Measurement Unit and Pin Electronics for Modular Mixed Signal Test Systems | 2.10 pm - 2.30 pm | |
| Block C | Industrial Forum | |||
| V. Mühlhaus/ Consulting & Software GmbH |
C1-1 | Sonnet EM Analysis for RFIC/MMIC | 3.00 pm - 4.30 am (!) | |
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| Thursday, April 30, 2009 | ||||
| Block D1 Session Chair A. Barghouthi |
Radio Frequency Synthesizers and Components | |||
| J.-C. Scheytt/IHP GmbH | D1-1 | Design of Integrated SiGe BiCMOS Frequency Synthesizers for Wireless Communications (INVITED) | 9.00 am - 9.30 am | |
| G. v. Büren, S. Wehrli, H. Jäckel/ETH, Zürich, Ch. Kromer/Aprius Inc., Sunnyvale USA, A. Huber/Institute of Microelectronics, University of Applied Sciences Northwestern Switzerland, T. Morf/IBM Research, Zurich Research Laboratory, Rüschlikon |
D1-2 | Differential Phase Frequency Detector with Zero Systematic Timing Misalignment | 9.30 am - 9.50 am | |
| D. Barras, M. Zahner, H.Jaeckel/ETH Zürich | D1-3 | Self-calibrated Local Oscillator for Carrier-based Impulse Radio UWB Transceivers | 9.50 am - 10.10 am | |
| Block D2 Session Chair C. Knochenhauer |
Photonics and Optical Communication Systems | |||
| K. Lear, R. Yan, S. P. Mestas, R. Safaisini/Colorado State University, Department of Electrical and Computer Engineering and School of Biomedical Engineering, Fort Collins, CO, USA |
D2-1 | An Integrated Photonic Waveguide Biosensor System on a Chip (INVITED) | 10.30 am - 11.00 am | |
| N. Ledentsov, J.A. Lott, V.A. Shchukin/VI Systems GmbH, Berlin, F. Hopfer, G. Fiol, A. Mutig, D. Bimberg/Institut für Festkörperphysik and Center of NanoPhotonics, TU Berlin, S.A. Blokhin, L. Y. Karachinsky, I. I. Novikov, A. M. Nadtochi/Abraham Ioffe Physical Technical Institute/St.Petersburg Physical Technical Science and Education Center of RAS St. Petersburg |
D2-2 | Novel Trends in High Speed VCSELs (INVITED) | 11.00 am - 11.30 am | |
| H. Gustat, C. Scheytt/ IHP Innovations for High Performance Microelectronics, Frankfurt/Oder, F. Winkler/Humboldt University Berlin |
D2-3 | Power Consumption Aspects of FIR Filter Implementations for 100 Gb/s DQPSK Receivers | 11.30 am - 11.50 am | |
| Block D3 Session Chair M. Wickert |
Radio Frequency Integrated Amplifiers | |||
| R. Quay, F. van Raay, J. Kühn, R. Kiefer, P. Waltereit, M. Musser, S. Maroldt, M. Dammann, M. Mikulla, O. Ambacher/Fraunhofer Institute for Applied Solid-State Physics (FhG-IAF), Freiburg |
D3-1 | L-to-Ka-Band AlGaN/GaN HEMT Power Amplifiers with High Efficiency (INVITED) | 1.00 pm - 1.30 pm | |
| S. J. Spiegel/RIO SYSTEMS, Alon Meir / Tel Aviv University, Israel | D3-2 | Analysis of Different Reference Current Schemes for Transmitter Power Control in SiGe Power Amplifier | 1.30 pm - 1.50 pm | |
| U. Mayer, Z. Tibensky, F. Ellinger/ Dresden University of Technology, Christian Rossberg/ TU Chemnitz |
D3-3 | Low-Power Ultra-Wideband BiCMOS Low Noise Amplifier with Noise Cancelation | 1.50 pm - 2.10 pm | |
| M. Robens, S. Bannwarth, R. Wunderlich, S. Heinen/RWTH Aachen |
D3-4 | Differential UWB-LNA for M-Sequence Radar | 2.10 pm - 2.30 pm | |
| Block D4 Session Chair W. Cai |
Radio Frequency Integrated Circuits, Antennas and Interconnects | |||
| H. Erkens, R. Wunderlich, S. Heinen/ RWTH Aachen |
D4-1 | A Low Cost, High Resolution Transmit/Receive Module RFIC for S-Band Phased Arrays | 3.00 pm - 3.20 pm | |
| H. Gustat/IHP Innovations for High Performance Microelectronics, Frankfurt/Oder, V. Bhaya/Birla Institute of Technology and Science, Pilani, India, E. Karge/Humboldt University Berlin |
D4-2 | Lateral Inductive Coupling for Interchip Communication | 3.20 pm - 3.40 pm | |
| F. Ohnimus, I. Ndip, S. Guttowski, H. Reichl/ Fraunhofer Institute for Reliability and Microintegration, Berlin, Berlin Institute of Technology |
D4-3 | Electrical Design Challenges and Techniques for Passive RFID Tag Antennas | 3.40 pm - 4.00 pm | |
| H. Yordanov, P. Russer/ TU München |
D4-4 | On-Chip Integrated Antennas for Wireless Interconnects | 4.00 pm - 4.20 pm | |
| Ch. Knochenhauer, S. Hauptmann, F. Ellinger/Dresden University of Technology |
D4-5 | Investigating Packaging Influences on Signal Bandwidth in High-Speed Broadband Communication Systems | 4.20 pm - 4.40 pm | |
| Block E1 Session Chair R. Wolf |
Highly Efficient Power Semi-conductors | |||
| A. Mittal/ Infineon Technologies AG, Neubiberg |
E1-1 | Plenarvortrag: Microelectronics - an Enabler for Energy Saving in ICT |
9.00 am - 9.30 am | |
| Block E2 Session Chair J.-W. Bartha |
Semiconductor Fabrication | |||
| T. Leitermann/ Infineon Technologies |
E2-1 | High Automation as Part of a 200m Prime Fab at Infineon Dresden (INVITED) | 9.50 am - 10.20 am | |
| M. Romauch/ Infineon Technologies |
E2-2 | Advanced Equipment Capacity Planning Based on Mathematical Modelling (INVITED) | 10.20 am - 10.50 am | |
| I. Österreicher, U. Rossberg, S. Eckl/ Infineon Technologies |
E2-3 | Active Voltage Contrast and Seebeck Effect Imaging as Complementary Techniques for the Localization of Resistive Interconnections | 10.50 am - 11-10 am | |
| M. Zeuner, F. Allenstein, M. Demmler, M. Nestler/Roth & Rau AG | E2-4 | Ultra-precise Device Trimming for Semiconductor Technology | 11.10 am - 11.30 am | |
| Block E3 Session Chair N. Thyssen |
Semiconductor Testing and Reliability | |||
| C. Kratzer/ Infineon Technologies |
E3-1 | Extended Fast Wafer Level Reliability Dielectrics Monitoring | 1.00 pm - 1.20 pm | |
| R. Jancke/Fraunhofer-Institut für Integrierte Schaltungen, Dresden, Ch. Ellmers, R. Gaertner/ X-FAB Dresden |
E3-2 | Design of Reliable Circuits by Determination of SOA Borders as Part of the Degradation Analysis | 1.20 pm - 1.40 pm | |
| S. Richter, A. Bemmann, G. Moucha, S. Thiem/ X-FAB Dresden, H. Haberla/X-FAB Semiconductor Foundries, Erfurt |
E3-3 | Modeling and Simulation of the Reliability Behavior of Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) Memory Transistors | 1.40 pm - 2.00 pm | |
| Block E4 Session Chair J.-W. Bartha |
Semiconductor Via Fabrication | |||
| R. Holmer/ Infineon Technologies/ University of Applied Sciences,Regensburg |
E4-1 | Test Chip for Via Process Improvement - A Successful Cooperation between Infineon Regensburg and University of Applied Science Regensburg | 2.30 pm - 2.50 pm | |
| S. Pargfrieder, J. Meiler, J. Burggraf/ EV Group, St.Florian/Inn, Austria, M. Privett, X. Shao/ Brewer Science, Inc., Rolla, MO, USA |
E4-2 | Temporary Bonding and DeBonding Technology Enabling TSV Formation and 3D Integration for Ultra-thin Wafers | 2.50 pm - 3.10 pm | |
| J. Meiler, S. Pargfrieder, P. Lindner, M. Wimplinger/ EV Group, St.Florian/Inn, Austria |
E4-3 | New Technologies for Advanced High Density 3D Packaging by Using TSV Process | 3.10 pm - 3.30 pm | |
| Block F1 | Lecture | |||
| F. Ellinger/ Dresden University of Technology |
F1-1 | Noise, Linearity and Compression Part of Radio Frequency Integrated Circuits Course at Dresden University of Technology |
9.20 am - 10.50 am | |
| Block F2 | Industrial Forum | |||
| Ruben Zowada/ Cascade Microtech Germany |
F2-1 | Advancements in On-Wafer Measurements: A Commercial Multi-Line TRL Calibration | 11.00 am - 11.45 am | |