A. zu Hohenlohe, R. Weigel, M. Schroeter, F. Ellinger
story, INVITED
J. W. Bartha, TU Dresden
Transistor Design and Optimization for achieving
Record RF
Performance in Silicon Technologies, INVITED
B. Jagannathan, IBM, USA
Applications, INVITED
B. Heinemann, IHP GmbH, Frankfurt/Oder
HV. Dudek, Atmel
Nano-Scale CMOS, INVITED
C. Wicpalek, G. Hueber, G. Strasser,
B. Neurauter, DICE Linz
G. Böck, TU Berlin, Microwave Engineering Lab.
and Multistandard Challenges in Upcoming
RF-Frontends, INVITED
T. Richter, P. Zampardi,
Skyworks Solutions, Inc.
Systems, INVITED
M. Simon, Infineon Technologies,
R. Weigel, Universität Erlangen-Nürnberg
R. Eickhoff, F. Ellinger, U. Mayer,
Dresden University of Technology, Chair for
Circuit Design and Network Theory,
I. Santamaría, University of Cantabria
Concepts and Technological Challenges, INVITED
H. Jäckel, ETH Zurich, Electronics Lab, Ife
Efficient design of high-speed ICs beyond 100 Gb/s
with special regard to SiGe-bipolar technology
M. Möller, Saarland University, and Micram
Microelectronic GmbH
very High Density Data-Link Applications in 90-nm CMOS
J. Weiss, T. Morf, M. L. Schmatz
IBM Zurich Research Laboratory
P. Emma, IBM T.J. Watson Research Center
H. Jaeckel, ETH Zurich, Electronics Lab, Ife
Couplers in 0.25 µm CMOS
G. von Büren, L. Rodoni, D. Barras, S. Wehrli,
H. Jäckel ETH Zurich, Electronics Lab.,
F. Ellinger, Dresden University of Technology
20 Gb/s in 90 nm CMOS
L. Rodoni, G. von Büren, H. Jäckel,
ETH Zurich, Electronics Lab.,
F. Ellinger, Dresden University of Technology
A. Huber, Fachhochschule Nordschweiz, IME
M. Berroth, Universität Stuttgart
M. Schroeter, TU Dresden,
Electron Devices and Integrated Circuits
M. Rudolph, Ferdinand-Braun-Institut für
Höchstfrequenztechnik
J. Sturm, Carinthia University of Applied
Sciences, H. Zimmermann, TU Wien, Institut
für Elektrische Mess-und Schaltungstechnik
and Validation of Integrated Circuits
C. Gindorf, National Instruments Germany
New Test Capability for Power Devices
R. Zowada, Cascade Microtech Germany
and Optimization
D. Crawford, Ansoft
Reliability Test to streamline the Development Cycle
B. Hirschfeld, SUSS MicroTec
Factor Correction (PFC)
S. Brenner, Productivity Engineering
Gesellschaft für IC Design mbH
F+E Förderung - Bindungsfristen, Rückforderung, Haftung
D. Kresser, Kanzlei Nörr Stiefenhofer
Lutz & Partnerschaft
Microsystems GmbH
Participation free of any costs. For 6-8 Persons only.
Advanced Registration necessarily required.
In case of interest tour can be additionally arranged
on Thursday.
From the Semiconductor/Bare Dies to the functionally
tested electronics module.
Board Manufacturing - Die Attach - Chip Packaging - Wire
Bonding - Multi-Chip-Modules and Customized System in
Packages - Test Boards - Automatic Assembly
Kulturpalast
1:15 pm
Arrival
3:10 pm
We are looking forward to present one of the outstanding
jazz formations within Saxony- the Sven Helbig
Trio (piano, bass and drums).
Be inspired by their fresh and virtuosic interpretations
of classical and modern jazz music.
Well known by their cooperation with bands such as the
Pet-Shop Boys, Rammstein and by the foundation
of the Dresdner Sinfoniker, the Sven Helbig Trio will be
the cultural highlight of the evening!
D. Landgraf-Dietz, SILICON SAXONY
Electronic Packaging, INVITED
T. Zerna, TU Dresden,
Center of Microtechnical Manufacturing,
K.-J. Wolter, TU Dresden,
Electronic Packaging Laboratory
Systems in Package
U. Knöchel, Fraunhofer IIS/EAS Dresden
H.-J. Golberg, Atmel Germany GmbH Ulm
K. Viehweger, K. Richter, U. Künzelmann, H.
Wojcik, U. Merkel, A. Hiess, A. Jahn,
C. Wenzel, J.W. Bartha, TU Dresden,
Institut für Halbleiter- und Mikrosystemtechnik
Cu Wires for US Wedge Wedge Bonding at
Room Temperature
C. Nobis, C. Klaus, H. Hiemann, F. Rudolf, C.
Wenzel, J.-W. Bartha, TU Dresden,
Institut für Halbleiter- und Mikrosystemtechnik
Current Status and Future Challenges
S. Dobritz, Qimonda AG
Finish for Soldering/Bonding Application in
Semiconductor Industry
A. Uhlig, Atotech Deutschland GmbH
are needed in a High Temperatur plus
Frequency Independent Package
H. Fischer, H+B Ingenieurbüro und
Unternehmensberatung GmbH
and millimeter- wave applications, INVITED
H. Schumacher, Universität Ulm
Short-Range Wireless Communication at 60 GHz and
Beyond, INVITED
C. Scheytt, IHP GmbH, Frankfurt/Oder
process technologies, INVITED
U. Pfeiffer, Universität Wuppertal
F. Ellinger, Chair for Circuit Design and
Network Theory, TU Dresden
™ICs: Limits and Challenges
B. Bieske, Institut für Mikroelektronik- und
Mechatronik-Systeme gGmbH, Ilmenau
M. Lange, S. Beyer, Atmel, Heilbronn
K. Luther, Infineon Technologies, Neubiberg
Residual Stress Measurement on Semiconductor
Layers Utilizing
Stress Relief Techniques
F. Luczak, B. Michel, A. Gollhardt, D. Vogel,
Fraunhofer IZM, Micro Materials Center
Chemnitz,
U. Lehr, M. Grillberger, V. Jaschke,
H. Geisler, AMD Saxony, Dresden
Charge Profiling Method (QCS Tool)
M. Sukowski, F. Heider, Infineon Technologies,
Villach (A), G.Krzych, QC Solutions, Inc., Alzenau
Post-Processing at Wafer Test
A. Kaestner, F. Ruckerbauer,
Infineon Technologies Regensburg
G. Zwicker, Fraunhofer Institut fuer
Siliziumtechnologie ISIT
Test Environment for Signal-Acquisition ASICs
Ch. Jakobi, F. Wagner, J.M. Tomasik, K. M.
Hafkemeyer, W. Galjan, D. Schroeder, W. H.
Krautschneider, TU Hamburg-Harburg
Solutions Member of the Executive Management
Board Infineon Technologies
Moore's Law and RF Design - Conjoint or Diverging ?
AEC-Q100-Rev-F
L. Lehmann, IEE Vision Sensing GmbH
Capabilities of Polishing Processes
G.Moersch, J. Kanzow, M. Langenkamp, S.
Werth, M. Lauter, Peter Wolters GmbH
SONOS-Memory-Module For CMOS-Technologies
M. Wickert, F. Ellinger, R. Schüffny, TU
Dresden, R. Herberholz, F. Roger, P. Wensley,
A. Cuthbertson, ATMEL North-Tyneside,
F. Roger als Co-Author
Smith Chart, S-Parameter and Impedance Transformation
F. Ellinger, Dresden University of
Technology,Chair for Circuit Design and
Network Theory
What can Chip Designers learn from Nature? INVITED
A. Herkersdorf, TU München
of an Automotive Control Unit
C. Heinz, H. Rauch, iSyst GmbH
Technology Parameters
U. Eichler, J. Haase,
Fraunhofer IIS/EAS Dresden,
R. Häußler, H. Kinzelbach,
Infineon Technologies, Munich
Local Positioning System
M. Krcmar, V. Subramanian, G. Böck,
TU Berlin, Microwave Engineering Lab
RFID Transponders
Q. Fu, N. Gay, C. Bansleben, R. Hildebrand, W.
J. Fischer, Fraunhofer Institut für Photonische
Mikrosysteme (IPMS)
Sensor Interface for Microwave RFID Transponders
N. Gay, Q. Fu, C. Bansleben, R. Hildebrand,
W.-J. Fischer
R. Eickhoff, F. Ellinger, Dresden University of Technology,
T. Ußmüller, University of Erlangen-Nuremberg,
J. Hüttner, R. Gierlich,
Siemens AG Munich
the Semiconductor Industries
M. A. Ahlhaus, Kanzlei Nörr Stiefenhofer Lutz & Partnerschaft
RFIC Inductor & Interconnect Modelling
Dr. Mühlhaus Consulting & Software GmbH
SUSS MicroTec
Wafer-level RF & Microwave Testing
Robotron Datenbank-Software GmbH
Effective Analysis of Wafer Defects at AMD 36 LLC using
a Modern Error Tracking System