The Call for Papers for this year’s SCD is completed – the workshop program is published.
The proceedings for the conference will be published on CD.
Speakers are requested to send in their presentations (ppp….) as PDF-files to verena.staab@gerotron.com until 9th April
Silicon on insulator, strained silicon, aggressively scaled CMOS, SiGe, GaN, GaP, advances and application of adhesives, encapsulants, underfills, solder alloys, halogen-free materials, dielectrics, thin films, ceramics, composites, nano-materials, optical materials and characterization techniques, wafer (prime) production, CMP, HFP
Wafer bumping and thinning, process characterization, cost and cycle time reduction
Component, board and system level reliability assessment, failure analysis, interfacial adhesion, accelerated testing and models, component and system qualification
Wire bonding, flip chip (eutectic/lead-free solders), solder replacement flip chip (ICP, ACP, ACF, NCP), under bump metallurgy, high density substrates, microvia, build-up technologies, substrate metallurgy, embedded passives & actives, wafer/device level, MEMS, 3D and novel interconnects
EDA, electrical, thermal, thermo-mechanical, reliability, optical modeling and simulation for component and system level applications
RF, mixed-signal, analogue and digital systems and circuits for high speed, low power consumption, low costs, and advanced performance and density, application of aggressively scaled CMOS of 90 nm and below
New packaging technologies for single chip, multi-chip, wafer level, power and stacked-die packages addressing fine pitch, high I/O and performance issues
Optical component assemblies, electro-optical modules, waveguides, Inertial MEMS, RF, Optical & Bio MEMS
PAPER SUBMISSION - DEADLINE EXTENDED TO JANUARY 27, 2009!
Submission of papers in the areas mentioned above are encouraged and solicited to describe original work. The paper must include the purpose, applications, results, comparison with the state-of-the-art, conclusions, visualizing pictures and key references.
Layout and guidelines for the paper:
2-4 pages, text in double columns, details see template. Authors must include their affiliation, mailing address, telephone and fax numbers, and email address between paper title and text.
All submissions must be in English and should be send via electronic mail to: info@gerotron.com using pdf format with file size of less than 5MB until
Furthermore, the submission of proposals for workshops, tutorials and short courses is called for, again no later than
Notification of paper acceptance
