| Wednesday, April 29, 2009 |
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C. Zimmer-Konrad, H. Eul, G. Fettweis / Overall Chair, F. Ellinger / Technical Chair:
Get Together and Welcome |
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Block A1
Session Chair M. Schroeter |
Radio Frequency Technologies and Communication Systems
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R. Kraemer/IHP GmbH |
A1-1 |
Challenges for Wireless 100 Gb/s Transmission from System down to IC Level (INVITED) |
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9.30 am - 10.00 am |
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M. Schlechtweg, A.Tessmann, I. Kallfass, A. Leuther,
R. Weber, S. Chartier,
R. Driad, R. E. Makon,
V. Hurm, H. Massler,
M. Kuri,
F. Benkhelifa,
R. Lösch, J. Rosenzweig, and O. Ambacher/ Fraunhofer Institute for Applied Solid State Physics (IAF) |
A1-2 |
High-Performance MMICs and High-Speed Mixed-Signal ICs Based on III/V HEMT and HBT Technology for Sensors and Communication (INVITED) |
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10.00 am - 10.30 am |
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R. Lachner/
Infineon Technologies |
A1-3 |
SiGe Technology Paves the Way for Radar Based Vehicle Safety Affordable for Everyone (INVITED) |
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10.30 am - 11.00 am |
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Block A2
Session Chair M. Claus
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Hetero Bipolar Transistor Technology |
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C. R. Bolognesi/ETH Zürich |
A2-1 |
High-Speed High-Power mm-Wave Devices (INVITED) |
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1.00 pm - 1.30 pm |
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M. Schroeter/TU Dresden/
UC San Diego, USA |
A2-2 |
Future Opportunities for Bipolar Transistor Technology (INVITED) |
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1.30 pm - 2.00 pm |
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M. Al-Sa’di, C. Maneux,
T. Zimmer/Université de Bordeaux,
S. Fregonese/CNRS,
Talence Cedex, France |
A2-3 |
Investigation of Electrical BJT Performance Improvement through Extrinsic Stress Layer Using TCAD Modeling |
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2.00 pm - 2.20 pm |
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Block A3
Session Chair M. Schroeter
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Device and Technology Modeling |
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D. Schreurs/Katholieke Universiteit Leuven, Belgien |
A3-1 |
Microwave Modelling of Emerging Device Technologies (INVITED) |
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2.40 pm - 3.10 pm |
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K. E. Moebus, Y. Zimmermann, M. Schroeter, Dresden University of Technology/
UC San Diego, USA |
A3-2 |
Schwarz-Christoffel Mapping for LDMOS and Bipolar Transistor Modeling |
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3.10 pm - 3.30 pm |
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M. Claus, S. Mothes,
M. Schroeter/Dresden University of Technology |
A3-3 |
A Numerical Device Simulator for Nanoscale Carbon Nanotube Transistors |
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3.30 pm - 3.50 pm |
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Y. Zimmermann,
K. E. Moebus, H. Wittkopf,
M. Schroeter/ Dresden University of Technology/
UC San Diego, USA |
A3-4 |
TRADICA – An Integrated Modeling Tool Linking Process and Circuit Design |
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3.50 pm - 4.10 pm |
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B. Curran, I. Ndip,
S. Guttovski/Fraunhofer Institute for Reliability and Microintegration, Berlin,
H. Reichl/TU Berlin |
A3-5 |
Modeling and Categorization of the Resistivity of Silicon Wafers for the Design of Silicon Based System Modules |
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4.10 pm - 4.30 pm |
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Block B1
Session Chair G. Fettweis |
Digital Embedded Systems |
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H. Meyr/RWTH Aachen |
B1-1 |
Next Generation Mobile Devices:
A System Design Challenge (INVITED) |
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9.30 am - 10.00 am |
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M. Porrmann/
Universität Paderborn |
B1-2 |
Rapid Prototyping of Next-Generation Multiprocessor SoCs (INVITED) |
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10.00 am - 10.30 am |
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S.-B. Kim, R. Wunderlich,
S. Heinen/RWTH Aachen /
IC design and Microelectronics Center,
State Academy of Sciences, Pyongyang,
DPR Korea |
B1-3 |
A Consideration on Design Methods for Continuous-Time Quadrature Bandpass Sigma-Delta Modulators |
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10.30 am - 10.50 am |
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Block B2
Session Chair R. Eickhoff |
Low Power Digital Design |
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U. Rückert/
Universität Paderborn |
B2-1 |
Potential of Subthreshold Logic for Ultra Low-Power Digital Systems (INVITED) |
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11.10 am - 11.40 am |
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T. Noll/RWTH Aachen |
B2-2 |
Energy Efficiency vs. Reliability in the Last Quarter of Moore’s Law (INVITED) |
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11.40 am - 12.10 pm |
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D. Brenk, J. Essel, J. Heidrich, F. Cilek, R. Weigel/
Friedrich Alexander University Erlangen-Nuremberg |
B2-3 |
An Ultra Low Power ADC for Sensor Applications in Passive UHF RFIDs |
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12.10 pm - 12.30 pm |
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Block B3
Session Chair N. Thyssen |
Mixed Signal Circuit Testing Communication Systems |
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U. Sobe, K.-H. Rooch,
D. Mörtl, A. Graupner/
ZMD AG, A. Lerch/X-FAB Semiconductor Foundries AG, Erfurt, M. Pronath/MunEDA GmbH, München |
B3-1 |
Verification Method for Analog and Mixed Circuits Considering Performance Parameters and Safe Operating Area (SOA) Constraints |
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1.30 pm - 1.50 pm |
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I.Gryl, V. Schulze/IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gGmbH, Ilmenau |
B3-2 |
Application of a Modular Test System for Mixed Signal Tests |
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1.50 pm - 2.10 pm |
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A. Rolapp, R. Paris/
IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gGmbH, Ilmenau |
B3-3 |
Parametric Measurement Unit and Pin Electronics for Modular Mixed Signal Test Systems |
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2.10 pm - 2.30 pm |
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Block C |
Industrial Forum |
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J. Mühlhaus/
Consulting & Software GmbH |
C1-1 |
Sonnet EM Analysis for RFIC/MMIC |
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3.00 pm - 4.30 pm |
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| Thursday, April 30, 2009 |
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Block D1
Session Chair A. Barghouthi |
Radio Frequency Synthesizers and Components |
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J.-C. Scheytt/IHP GmbH |
D1-1 |
Design of Integrated SiGe BiCMOS Frequency Synthesizers for Wireless Communications (INVITED) |
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9.00 am - 9.30 am |
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G. v. Büren, S. Wehrli,
H. Jäckel/ETH, Zürich,
Ch. Kromer/Aprius Inc., Sunnyvale USA,
A. Huber/Institute of Microelectronics, University of Applied Sciences Northwestern Switzerland,
T. Morf/IBM Research,
Zurich Research Laboratory, Rüschlikon |
D1-2 |
Differential Phase Frequency Detector with Zero Systematic Timing Misalignment |
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9.30 am - 9.50 am |
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D. Barras, M. Zahner, H.Jaeckel/ETH Zürich |
D1-3 |
Self-calibrated Local Oscillator for Carrier-based Impulse Radio UWB Transceivers |
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9.50 am - 10.10 am |
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Block D2
Session Chair
C. Knochenhauer |
Photonics and Optical Communication Systems |
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K. Lear, R. Yan, S. P. Mestas, R. Safaisini/Colorado State University, Department of Electrical and Computer Engineering and School of Biomedical Engineering,
Fort Collins, CO, USA |
D2-1 |
An Integrated Photonic Waveguide Biosensor System on a Chip (INVITED) |
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10.30 am - 11.00 am |
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N. Ledentsov, J.A. Lott,
V.A. Shchukin/VI Systems GmbH, Berlin, F. Hopfer,
G. Fiol, A. Mutig,
D. Bimberg/Institut für Festkörperphysik and Center of NanoPhotonics, TU Berlin, S.A. Blokhin,
L. Y. Karachinsky,
I. I. Novikov,
A. M. Nadtochi/Abraham Ioffe Physical Technical Institute/St.Petersburg Physical Technical Science and Education Center of RAS St. Petersburg |
D2-2 |
Novel Trends in High Speed VCSELs (INVITED) |
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11.00 am - 11.30 am |
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H. Gustat, C. Scheytt/
IHP Innovations for High Performance Microelectronics, Frankfurt/Oder,
F. Winkler/Humboldt University Berlin |
D2-3 |
Power Consumption Aspects of FIR Filter Implementations for 100 Gb/s DQPSK Receivers |
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11.30 am - 11.50 am |
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Block D3
Session Chair M. Wickert |
Radio Frequency Integrated Amplifiers |
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R. Quay, F. van Raay,
J. Kühn, R. Kiefer,
P. Waltereit, M. Musser,
S. Maroldt, M. Dammann, M. Mikulla,
O. Ambacher/Fraunhofer Institute for Applied Solid-State Physics (FhG-IAF), Freiburg |
D3-1 |
L-to-Ka-Band AlGaN/GaN HEMT Power Amplifiers with High Efficiency (INVITED) |
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1.00 pm - 1.30 pm |
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S. J. Spiegel/RIO SYSTEMS, Alon Meir /
Tel Aviv University, Israel |
D3-2 |
Analysis of Different Reference Current Schemes for Transmitter Power Control in SiGe Power Amplifier |
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1.30 pm - 1.50 pm |
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U. Mayer, Z. Tibensky,
F. Ellinger/
Dresden University of Technology,
Christian Rossberg/
TU Chemnitz |
D3-3 |
Low-Power Ultra-Wideband BiCMOS Low Noise Amplifier with Noise Cancelation |
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1.50 pm - 2.10 pm |
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M. Robens, S. Bannwarth,
R. Wunderlich,
S. Heinen/RWTH Aachen |
D3-4 |
Differential UWB-LNA for M-Sequence Radar |
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2.10 pm - 2.30 pm |
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Block D4
Session Chair W. Cai |
Radio Frequency Integrated Circuits, Antennas and Interconnects |
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H. Erkens, R. Wunderlich,
S. Heinen/
RWTH Aachen |
D4-1 |
A Low Cost, High Resolution Transmit/Receive Module RFIC for S-Band Phased Arrays |
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3.00 pm - 3.20 pm |
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H. Gustat/IHP Innovations for High Performance Microelectronics, Frankfurt/Oder,
V. Bhaya/Birla Institute of Technology and Science, Pilani, India,
E. Karge/Humboldt University Berlin |
D4-2 |
Lateral Inductive Coupling for Interchip Communication |
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3.20 pm - 3.40 pm |
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F. Ohnimus, I. Ndip,
S. Guttowski,
H. Reichl/
Fraunhofer Institute for Reliability and Microintegration, Berlin,
Berlin Institute of Technology |
D4-3 |
Electrical Design Challenges and Techniques for Passive RFID Tag Antennas |
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3.40 pm - 4.00 pm |
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H. Yordanov, P. Russer/
TU München |
D4-4 |
On-Chip Integrated Antennas for Wireless Interconnects |
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4.00 pm - 4.20 pm |
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Ch. Knochenhauer,
S. Hauptmann,
F. Ellinger/Dresden University of Technology |
D4-5 |
Investigating Packaging Influences on Signal Bandwidth in High-Speed Broadband Communication Systems |
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4.20 pm - 4.40 pm |
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Block E1
Session Chair R. Wolf |
Highly Efficient Power Semi-conductors |
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A. Mittal/
Infineon Technologies AG, Neubiberg |
E1-1 |
Plenarvortrag:
Microelectronics - an Enabler for Energy Saving in ICT |
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9.00 am - 9.30 am |
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Block E2
Session Chair J.-W. Bartha |
Semiconductor Fabrication |
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T. Leitermann/
Infineon Technologies |
E2-1 |
High Automation as Part of a 200m Prime Fab at Infineon Dresden (INVITED) |
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9.50 am - 10.20 am |
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Martin Romauch/
Infineon Technologies |
E2-2 |
Advanced Equipment Capacity Planning Based on Mathematical Modelling (INVITED) |
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10.20 am - 10.50 am |
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I. Österreicher,
U. Rossberg,
S. Eckl/
Infineon Technologies |
E2-3 |
Active Voltage Contrast and Seebeck Effect Imaging as Complementary Techniques for the Localization of Resistive Interconnections |
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10.50 am - 11-10 am |
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M. Zeuner, F. Allenstein, M. Demmler, M. Nestler/Roth & Rau AG |
E2-4 |
Ultra-precise Device Trimming for Semiconductor Technology |
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11.10 am - 11.30 am |
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Block E3
Session Chair N. Thyssen |
Semiconductor Testing and Reliability |
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C. Kratzer/
Infineon Technologies |
E3-1 |
Extended Fast Wafer Level Reliability Dielectrics Monitoring |
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1.00 pm - 1.20 pm |
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R. Jancke/Fraunhofer-Institut für Integrierte Schaltungen, Dresden,
Ch. Ellmers, R. Gaertner/
X-FAB Dresden |
E3-2 |
Design of Reliable Circuits by Determination of SOA Borders as Part of the Degradation Analysis |
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1.20 pm - 1.40 pm |
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S. Richter, A. Bemmann,
G. Moucha, S. Thiem/
X-FAB Dresden,
H. Haberla/X-FAB Semiconductor Foundries, Erfurt |
E3-3 |
Modeling and Simulation of the Reliability Behavior of Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) Memory Transistors |
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1.40 pm - 2.00 pm |
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Block E4
Session Chair J.-W. Bartha |
Semiconductor Via Fabrication |
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R. Holmer/
Infineon Technologies/
University of Applied Sciences,Regensburg |
E4-1 |
Test Chip for Via Process Improvement - A Successful Cooperation between Infineon Regensburg and University of Applied Science Regensburg |
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2.30 pm - 2.50 pm |
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S. Pargfrieder, J. Meiler,
J. Burggraf/ EV Group, St.Florian/Inn, Austria,
M. Privett, X. Shao/ Brewer Science, Inc., Rolla, MO, USA |
E4-2 |
Temporary Bonding and DeBonding Technology Enabling TSV Formation and 3D Integration for Ultra-thin Wafers |
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2.50 pm - 3.10 pm |
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J. Meiler, S. Pargfrieder,
P. Lindner,
M. Wimplinger/
EV Group, St.Florian/Inn, Austria |
E4-3 |
New Technologies for Advanced High Density 3D Packaging by Using TSV Process |
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3.10 pm - 3.30 pm |
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Block F1 |
Lecture |
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F. Ellinger/
Dresden University of Technology |
F1-1 |
Noise, Linearity and Compression
Part of Radio Frequency Integrated Circuits Course at Dresden University of Technology |
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9.20 am - 10.50 am |
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Block F2 |
Industrial Forum |
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Ruben Zowada/
Cascade Microtech Germany |
F2-1 |
Advancements in On-Wafer Measurements: A Commercial Multi-Line TRL Calibration |
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11.00 am - 11.45 am |